Harry Potter and the Goblet of Fire (USA, Europe) (En,Fr,De,Es,It,Nl,Da): Entry #1 [Kurodo]
- Release
- AGB-BH8P-EUR
- Stamp on case
- 11 E3
Board
- Board type
- AGB-E24-01
- Manufacture date
- September/2005
- Circled letter(s) on board
- I
- Position in PCB panel
- B-1
Parts
| Part | Type | Manufacturer | Date | Label | |
|---|---|---|---|---|---|
| U1 | ROM | MX23L25607-12D2 | Macronix | Week 49/2005 | E054953-MG MX23L25607-12D2 AGB-BH8P-0 K2 2N496501 |
| U2 | EEPROM | 9853 | ROHM | October/2005 | 9853 5A62 |